MediaTek has introduced the Dimensity 7300, and 7300X chipsets, which promise up to 25% reduced power consumption than their predecessor, the 7050 SoC. According to the Taiwan-based behemoth, the 7300X supports dual displays. It is expected to come up in the soon-to-be-released Motorola Razr 50, although there is no confirmation.
Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business, commented on the introduction 'The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game'.
He added 'the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support'.
Let's take a key look at the specifications of the new MediaTek Dimensity 7300 series.
The new chips are equipped with an octa-core CPU with four Arm Cortex-A78 cores running at up to 2.5GHz and four Arm Cortex-A55 cores. The 4nm technique reduces energy use in the A78 cores by up to 25% as compared to the Dimensity 7050. For an enhanced gaming experience, the CPU has the most recent Arm Mali-G615 GPU with several MediaTek HyperEngine enhancements. The Dimensity 7300 series provides 20% faster FPS and 20% more energy efficiency than rivals. Further, they boast Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio, smart resource optimization, optimized 5G, and Wi-Fi game connections for improved gaming capabilities.
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The MediaTek Imagiq 950 ISP, which supports up to a 200-megapixel primary camera and has a 12-bit HDR ISP, is also included in the new Dimensity 7300 series. In addition, the hardware engines provide video HDR, hardware face detection (HWFD), and multi-channel noise reduction (MCNR), which enable users to take bright pictures/videos in almost any kind of lighting.
Further adding to this, the company claims 'live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos'.
The chipsets are equipped with the MediaTek APU (Agent Processing Unit) 655, which increases the efficiency of AI operations. They support mixed-precision data types, allowing for improved memory bandwidth usage and lower memory requirements for bigger AI models.
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In terms of connectivity, the MediaTek Dimensity 7300 chipsets promise improved power efficiency in 5G sub-6GHz connections by 13–30%. They also support up to 3.27Gb per second 5G downlinks using 3CC carrier aggregation while offering faster downlinks in suburban and urban settings. The recently introduced series also supports Tri-band Wi-Fi 6E, dual 5G SIM, and dual VoNR (Voice over New Radio).
